December 5, 2006
Applied Materials, Inc. today announced its new Applied Opus(TM) AdvantEdge(TM) Metal Etch, the industry's fastest, most advanced system for etching sub-70nm aluminum interconnects in leading-edge Flash and DRAM memory devices. The system removes a critical etch bottleneck for customers by employing a process-optimized 5-chamber configuration (3 etch, 2 strip). Compared to standard 4-chamber metal etchers, the Opus AdvantEdge delivers 50% better critical dimension (CD) uniformity, a 2x faster strip rate with enhanced corrosion resistance, and 50% higher throughput - while still maintaining a standard etch bay footprint.
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